Guangdong Junya Electronic Technology Co., Ltd.

HLC PCB

SPEC	2026	2027	2028
Layer	44L	50L	60L
Registration (≤24L)	D+10	D+9	D+8
Aspect Ratio	30:1	40:1	50:1
Back-drill Stud	5±3mil	4±2mil	2±2mil
BGA Pitch/mil	31.5	30	30
Back-drill (Pad to Pad)	D+6	D+4	D+4
Back-drill (Pad to Trace)	D+4.2	D+4	D+4
Thickness/mm	6	8	10
PNL Max PNL Size /inch	24.4*28.4	24.4*36.4	24.4*40.0
Max Inner/Outer Copper	6oz（4oz）	6oz（4oz）	6oz（4oz）
Impedance	± 10%（7%）	±8%（5%）	± 7%（5%）
Min. Drill Hole/mil	6	6	6
Press Hole /mil	±1.6	±1.6	±1.6
Gold Finger Position/mil	±2.0	±2.0	±2.0
Inner Layer L/S（1oz）	2.5/3.0mil	2.0/3.0mil	2.0/3.0mil
Landless Back-drill	√	√	√
Solder Mask	±1mil	±1mil	±1mil
Routing	±3mil	±3mil	±2mil
Pattern to Edge	±3mil	±3mil	±3mil
Hole to Edge	±3mil	±3mil	±3mil
POFV	AR 25:1	AR 35:1	AR 45:1
POFV	L/S 3.5/3.5mil	L/S 3.0/3.5mil	L/S 3.0/3.5mil
Material	M8/M9	M9/M10	M9/M10
Process Feature	Asym. Lamination	Asym. Lamination	Asym. Lamination
Process Feature	Skip Via(1-4)	Skip Via(1-4)	Skip Via(1-5)
Electrical Performance	SI Sim./ Analysi	SI Sim./ Analysi	SI Sim./ Analysi
Electrical Performance	SI Control（67Ghz）	SI Control（112Ghz）	SI Control（112Ghz）
Surface Finish	OSP,ENIG,OSP+ENIG,	OSP,ENIG,OSP+ENIG,	OSP,ENIG,OSP+ENIG,
Surface Finish	HASL，GOLD	HASL，GOLD	HASL，GOLD

Sample/Small-medium batch PCB

Process	SPEC		Sample Capabilities	Small / Medium Batch Capabilities
Normal	Layers Count		≤108 layers	≤46 layers
	Board Thickness		0.2~13.0mm	0.4~6.0mm
	Board Thickness Tolerance		±8%	±10%
	Impedance Tolerance	(Diff. IMP)≥50	±8%	±10%
	Impedance Tolerance	(SE IMP)≤50	±2.5Ω	±5Ω
	Warpage		≤0.3%	≤0.75%
Lamination	PP thickness		≥3mil	≥3mil
Drilling	Min Drilling Bit		0.125mm	0.15mm
	Hole Tolerance	PTH	±0.04mm	±0.05mm
	Hole Tolerance	NPTH	±0.025mm	±0.05mm
Plating	Aspect Ratio	PTH	25:1	12:1
	Inner Layer	Layers:4-10L	≥5.5mil	≥6.5mil
	Inner Layer	Layers:12-46L	≥7mil	≥8.5mil
	Inner layer line width/space	(H/HOZ)	2.5mil/2.5mil	3mil/3mil
	Max base copper thickness	Inner Layer	28OZ	6OZ
	Max base copper thickness	Outer Layer	28OZ	6OZ
	Outer layer line width/space	Copper:30~40um	3/3mil	3/4mil
	Outer layer line width/space	Copper:40~55um	3.5/3.5mil	4/5mil
	Line width tolerance	Line width≥10mil	±20um	±1mil
	Line width tolerance	Line width <10mil	±10%	±10%
	Pad tolerance	Pad >12mil	±1mil	±1mil
Solder Mask	Solder Mask Bridge		Green 3.5mil	Green 4mil
	Solder Mask Bridge		Other 5mil	Other 5mil
	S/M Plugging	Plugging hole diameter	0.15mm-0.6mm	0.2mm-0.6mm
	S/M Thickness	Line to surface	10~40um	10~40um
	S/M Thickness	Line to corner	≥5um	≥5um
Routing	Routing	Tolerance	±0.1mm	±0.13mm
Surface Treatment	Gold Finger	Gold thickness	0.127~2um	0.127~1.25um
	Gold Finger	Nickel thickness	2.54~6um	2.54~6um
	Immersion Gold	Gold thickness	0.03~0.2um	0.03~0.2um
	Immersion Gold	Nickel thickness	2.54~6um	2.54~6um
	OSP thickness	OSP film thickness	0.3~0.5μm	0.3~0.5μm
	HASL Lead free		1~40um	1~40um
	Immersion Sliver		6~9u"	6~9u"
	Immersion Tin		0.8~1.0um	0.8~1.0um
Gold Finger	Gold thickness		0.127~2um	0.127~1.25um
	Length Tolerance		±0.15mm	±0.15mm
	Length Tolerance		±0.1mm	±0.1mm
	Width Tolerance		±25um	±40um
Surface treatment: HASL lead free, immersion gold, immersion Tin, immersion Silver, Gold Finger, Hard/Soft gold plating, OSP, ENEPlG and Selective hard gold plating. Materials: FR4, Rogers, Arlon, Taconic, Bergguist, TUC, Panasonic M6/M7 and so on. Special technology: Blind & buried holes, Via in pad, Castellated holes, Counterbore, Step mounting holes, Controlled depth holes, edge-plating, metal base PCB, Stepped G/F, Back-drill, Mixed RF PCB, Busbar PCB, Copper coin embedded and Ceramic coin embedded.

FPC & RFPC

No.	Item	Capability
No.	Item	Capability		1	Layer Count	FPC:1-6 (layers) RFPC:2-12 (layers)
2	Finished Board Size (Max)	19.7″×21.6″(500mm×550mm)
3	Major CCL Brand	Doosan\Thinflex\TaiFlex\Shengyi\Taiyo\DongYi
4	Finished Board Thickness Tolerance	±0.03mm (Board Thickness≤ 0.2mm)
4	Finished Board Thickness Tolerance	±0.05mm (0.2mm
5	Warpage (Min)	YES
6	Drill Hole Diameter	Mech Drilling:0.1mm~6.5mm
		Laser Drilling:0.07-0.15mm
		Laser Drilling:0.03-0.07mm
7	Base Copper Thickness of Outer Layer	1/3 OZ-3OZ (0.012mm -0.105mm)
8	Base Copper Thickness of Inner Layer	1/3 OZ-2OZ (0.012mm -0.070mm)
9	Type of Base Material	0.07mm-2.0mm
10	Aspect Ratio of Plated Hole (Max)	8:1
11	Hole Diameter Tolerance (PTH)	±2mil ( ±0.050mm)
12	Hole Diameter Tolerance (NPTH)	±1mil ( ±0.025mm)
13	Copper Thickness of PTH Wall	10um min or meet customer requirement
14	Design Line Width/Space of Inner Layer(Min)	H/H OZ 2mil/2mil
		1/1 OZ 3mil/3mil
		2/2 OZ 4mil/4mil
		3/3 OZ 6mil/6mil
15	Design Line Width/Space of Outer Layer(Min)	H/H OZ 2mil/2mil
		1/1 OZ 3mil/3mil
		2/2 OZ 4mil/4 mil
		3/3 OZ 6mil/6mil
16	Solder Mask Bridge Width (Min)	3mil (0.075mm)
17	Solder Mask Alignment Tolerance	±2mil (±0.05mm)
18	Coverlay Bridge Width (Min)	8mil (0.2mm)
19	Coverlay Alignment Tolerance	±4mil (±0.10mm)
20	Dimension Tolerance (Hole to Edge)	±4mil ( ±0.1mm)
21	Test Capacity	PAD Size min (0.07mm)
21	Test Capacity	PAD Pitch min (0.2mm)
22	Stiffener Type	PI\FR4\SUS
23	Electromagnetic Shielding Technology	Film
24	Surface Treatment	OSP	0.2-0.5um
		(ENEPIG)	Au:0.02-0.1um
			Pd:0.05-0.1um
			Ni:2-8um
		(Plating Gold)	Au≥0.05um
		(Plating Gold)	Ni:2-8um

HDI PCB

Item		2026 Process Capability Status	2027 Process Capability Upgrade Plan	2028 Process Capability Upgrade Plan
HDI Blind Hole Structure		7+N+7	8+N+8	8+N+8
Drilling hole diameter(um)	Min Blind Hole	75	75	75
	Min Buried Hole	150	150	150
	Min Through Hole	150	150	150
Max Aspect Ratio	Laser Blind Hole	1:1	1:1	1.2 : 1
Max Aspect Ratio	Through Hole	16:1	30:1	30:1
Min core without copper thickness(um)		50	50	50
Finish Board Thickness (mm)		0.30~3.2	0.30~6.0	0.30~6.0
Laser Hole Filling Dimple (um)		7	5	5
Hole Tolerance (um)	PTH	±50	±50	±40
Hole Tolerance (um)	NPTH	±25	±25	±25
CNC Routing Tolerance (um)	Mass Production	±75	±50	±50
CNC Routing Tolerance (um)	Sample Production	±50	±50	±50
Impedance Tolerance		±10%(±8%)	±8%	±7%
Line Capability(um)	Line Width	~45	~40	~35
Line Capability(um)	Line Space	~45	~40	~35
Min BGA Pad Size (um)		150	150	100
Min BGA Space (Pitch)		0.30mm	0.30mm	0.25mm