Guangdong Junya Electronic Technology Co., Ltd.

MP batch of PCB

Range	Item		Capabilities
Normal	Layers Count		≤36L
	Board Thickness		0.30-6.0mm
	Thickness Tolerance		±10%
	Max PNL Size		610mm*710mm
	Warpage(Min)		≤0.5%
	Impedance Tolerance	Differential impedance≥50Ω	±8%
	Impedance Tolerance	Characteristic impedance≤50Ω	±10%
Stack up	PP Thickness		≥ 2.0mil
Drilling	Min Drilling diameter		0.15mm
	Hole diameter tolerance	PTH	±0.05mm
	Hole diameter tolerance	NPTH	±0.025mm
Plating	Aspect Ratio of Plated Hole(Max)		30:1
Line Design	Inner Layer	Layers：4-10L	≥5 mil
	Inner Layer	Layers: 12-16L	≥6 mil
	Inner Layer Line Width/Space	Inner Layer HOZ	2.5/2.5mil
	Max Base Copper	Inner Layer	≤5OZ
	Max Base Copper	Outer Layer	≤5OZ
	Outer Layer Line Width/Space		2.6/2.6mil
	Line width tolerance	Impedance Line	±10%
	Line width tolerance	None Imped Line	±20%
	Pad Tolerance	Pad≥10mil	≥±10%
Back Drill	Back Drill STUB		5±3mil
	BGA(Dual Lines) Back Drill Capa		37/(35)mil
	Back Drill Accuracy (Hole to Hole)		D+8～D+6mil
	Back Drill Accuracy (Hole to Line)		≥4.2mil
Solder Mask	Solder Mask Bridge		≥3mil
	Solder Mask Thickness	Line to Surface	10-40um
	Line to Corner	≥10um
Routing	Tolerance		±0.1mm
POFV Design	Aspect Ratio		30:1
POFV Design	Line Width/Line Space		3.5/3.5mil
Special Process	Asymmetry Hybrid, Skip Via（1-3）
CCL Capa	M7/PTFE、ULL+FR4 Hybrid
Electrical Property	SI Simulation/Analysis，SI Control（44Ghz）
Surface Treatment	Gold-plated plug	Gold thickness	0.127-1.0um
	ENIG	Gold thickness	0.03-0.10um
	OSP	Film thickness	0.2-0.6um
	HASL lead free		1-25um
	Immersion Silver		6-15u"
	Immersion Tin		0.8-1.2um

Sample and Small batch of PCB

Range	Item		Sample batch Capa	Small batch Capa
Normal	Layers Count		≦108L	≦46L
	Board Thickness		0.2~13.0mm	0.4~6.5mm
	Thickness Tolerance		±8%	±10%
	Impedance Tolerance	Differential impedance≥50Ω	±8%	±10%
	Impedance Tolerance	Characteristic impedance ≤50Ω	±2.5Ω	±5Ω
	Warpage(Min)		≦0.3%	≦0.75%
Stack up	PP Thickness	≧3mil	≧3mil
Drilling	Min Drilling diameter		0.125mm	0.15mm
	Hole diameter tolerance	PTH	±0.04mm	±0.05mm
	Hole diameter tolerance	NPTH	±0.025mm	±0.05mm
Plating	Aspect Ratio of Plated Hole(Max)		30:1	25:1
Line Design	Inner Layer	Layers: 4-10L	≥5.5mil	≥6.5mil
	Inner Layer	Layers: 12-36L	≥7mil	≥7mil
	Inner Layer Line Width/Space	Inner Layer HOZ	2.0mil/2.0mil	3mil/3mil
	Max Base Copper	Inner Layer	28OZ	6OZ
	Max Base Copper	Outer Layer	28OZ	6OZ
	Outer Layer Line Width/Space	30-40um	3/3mil	3/3mil
	Outer Layer Line Width/Space	40-55um	3.5/3.5mil	4/4mil
	总铜:40~55um	3.5/3.5mil	4/4mil
	Line width tolerance	Width≥10mil	±15μm	±1mil
	Line width tolerance	Width<10mil	±10%	±10%
Pad Tolerance	Pad≥12mil	±1mil	±1mil
Solder Mask	Solder Mask Bridge		3.5mil	4mi
	S/M Plugging	Plugging diameter hole	5mil	5mil
	S/M Thickness	Line to surface	10~40μm	10~40μm
	S/M Thickness	Line to corner	≧5μm	≧5μm
Routing	Tolerance		±0.1mm	±0.1mm
Surface Treatment	Gold-plated plug	Gold thickness	0.127~2μm	0.127~1.25μm
	Gold-plated plug	Ni thickness	2.54~6μm	2.54~6μm
	ENIG	Gold thickness	0.03~0.2μm	0.03~0.2μm
	ENIG	Ni thickness	2.54~6μm	2.54~6μm
	OSP	Film thickness	0.2~0.6μm	0.2~0.6μm
	HASL lead free		1~40μm	1~40μm
	Immersion Silver		6~15u"	6~15u"
	Immersion Tin		0.8~1.2μm	0.8~1.2μm
Gold Finger	Gold thickness		0.127-2μm	0.127-1.25μm
	Length Tolerance (Etching)		±0.15mm	±0.15mm
	Length Tolerance (Solder Mask)		±0.1mm	±0.1mm
	Width Tolerance		±25μm	±40μm

Surface treatment: HASL lead free, immersion gold, immersion Tin, immersion Silver, Gold Finger, Hard/Soft gold plating, OSP, ENEPlG and Selective hard gold plating.

Materials:FR4, Rogers, Arlon, Taconic, Bergguist, TUC, Panasonic M6/M7 and so on.

Special technology:Blind & buried holes, Via in pad, Castellated holes, Counterbore, Step mounting holes, Controlled depth holes, edge-plating, metal base PCB, Stepped G/F, Back-drill, Mixed RF PCB, Busbar PCB, Copper coin embedded and Ceramic coin embedded.

FPC & RFPC

No.	Item	Capabilities
1	Layers Count	FPC：1-6L RFPC：2-10L
2	Finished Board Size(Max)	19.7″×19.7″
3	Major CCL Brand	Doosan\Thinflex\Shengyi\Taiyo\DongYi
4	Finished Board Thickness Tolerance	±0.03mm(Thickness≤ 0.2mm) ±0.05mm(0.2mm＜Thickness≤0.5mm)
5	Blind/Buried Hole	YES
6	Min Drilling Hole Diameter	Mech Drilling：0.1mm~6.5mm Laser Drilling：0.1-0.125mm
7	Base copper of outer layer	1/3 OZ-2OZ (0.012mm -0.070mm)
8	Base copper of inner layer	1/3 OZ-1OZ (0.012mm -0.035mm)
9	Board Thickness	0.07mm-2.0mm
10	Aspect Ratio of Plated Hole(Max)	8:1
11	Hole Diameter Tolerance (PTH)	±3mil ( ±0.075mm)
12	Hole Diameter Tolerance (NPTH)	±1mil ( ±0.025mm)
13	Copper Thickness of PTH Wall	10um min or base on customer requirement
14	Design Line Width /Space of inner layer (Min)	H/H OZ 3mil/3mil 1/1 OZ 4mil/4mil 2/2 OZ 5mil/5mil 3/3 OZ 6mil/6mil
15	Design Line Width /Space of outer layer (Min)	H/H OZ 3mil/3mil 1/1 OZ 3mil/3mil 2/2 OZ 4mil/4 mil 3/3 OZ 6mil/6mil
16	Solder Mask Bridge Width (Min)	2.5mil (0.064mm)
17	Solder Mask Alignment Tolerance	±2mil (±0.05mm)
18	Coverlay Bridge Width(Min)	8mil (0.2mm)
19	Coverlay Bridge Alignment Tolerance	±6mil (±0.15mm)
20	Dimension Tolerance (Hole to Edge)	±4mil (±0.1mm)
21	Test Capacity	PAD Size min (0.1mm) PAD Pitch min (0.4mm)
22	Stiffener Type	PI\FR4\SUS
23	Electromagnetic Shielding Technology	Film / Silver Paste
24	Surface Treatment	OSP，ENIG，Plating Gold

HDI PCB

Item		2025	2026	2027
HDI Blind Hole Structure		5+N+5	6+N+6	7+N+7
Drilling hole diameter (um)	Min Blind Hole	75	75	75
	Min Buried Hole	150	150	150
	Min Through Hole	150	150	150
Max Aspect Ratio	Laser Blind Hole	1 ：1	1.2 ：1	1.2 ：1
Max Aspect Ratio	Through Hole	20 ：1	25 ：1	30 ：1
Min core without copper thickness (um)		50	50	50
Finish Board Thickness (mm)		0.40~3.2	0.30~4.0	0.25~5.5
Laser Hole Filling Dimple (um)		10	8	5
Hole Tolerance (um)	PTH	±50	±50	±40
Hole Tolerance (um)	NPTH	±0.025	±0.025	±0.025
Warpage		≤0.6%	≤0.5%	≤0.4%
CNC Routing Tolerance (um)	Mass Production	±100	±75	±50
CNC Routing Tolerance (um)	Sample Production	±50	±50	±50
Impedance Tolerance		±10% (±8%)	±8%	±8%
Line Capability (um)	Line Width	~45	~40	~35
Line Capability (um)	Line Space	~45	~40	~35
Min BGA Pad Size (um)		150	100	75
Min BGA Space (Pitch)		0.30mm	0.25mm	0.25mm